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| SHINDENGEN General Purpose Rectifiers SIL Bridges D15XB60 600V 15A FEATURES *oe Single In-Line Package Thin *oe High current capacity with Small Package *oe High IFSM *oe Superior Thermal Conductivity APPLICATION OUTLINE DIMENSIONS Case : 5S Unit : mm *oe power supply Switching *oe Home Appliances, Office Equipment *oe Factory Automation, Inverter RATINGS *oeAbsolute Maximum Ratings (If not specified Tc=25*Z) Item Symbol Conditions Ratings Unit Storage Temperature Tstg -40*150 *Z Operating Junction Temperature Tj 150 *Z Maximum Reverse Voltage VRM 600 V IO Average Rectified Forward Current50Hz sine wave, R-load With heatsink Tc=100*Z 15 A 50Hz sine wave, R-load Without heatsink Ta=25*Z 3.2 Peak Surge Forward CurrentIFSM 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25*Z A 200 I2 t 1ms*...t*10ms*@Tj=25*Z A2 s Current Squared Time 110 Dielectric Strength Vdis Terminals to case, AC 1 minute 2.5 kV Mounting Torque TOR * ecommended torque : 0.5Nm*j R i 0.8 Nm *oeElectrical Characteristics (If not specified Tc=25*Z) Item Symbol Conditions Ratings Unit VF IF Forward Voltage =7.5A, Pulse measurement, Rating of per diode Max.1.1 V IR V =V , Pulse measurement, Rating of per diode Max.10 EA Reverse Current R RM AEjc junction to case *@*@With heatsink Max.1.5 Thermal Resistance AEjl junction to lead *@ * Without heatsink @ Max.5 *Z/W AEja junction to ambient Without heatsink Max.22 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd D15XBx Forward Voltage 10 Forward Current IF [A] Tc=150C [TYP] Tc=25C [TYP] 1 Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Forward Voltage VF [V] D15XBx 60 Forward Power Dissipation SIN Forward Power Dissipation PF [W] 50 40 30 20 10 0 0 5 10 15 20 25 Average Rectified Forward Current IO [A] Tj = 150C Sine wave D15XBx 20 Derating Curve Heatsink Tc Tc Average Rectified Forward Current IO [A] SIN 15 10 5 0 80 90 100 110 120 130 140 150 160 Case Temperature Tc [C] Sine wave R-load with heatsink D15XBx 5 Derating Curve Average Rectified Forward Current IO [A] 4 SIN 3 PCB Glass-epoxy substrate Soldering land 5mm 2 1 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta [C] Sine wave R-load Free in air D15XBx 250 Peak Surge Forward Capability IFSM 10ms 10ms 1 cycle 200 Peak Surge Forward Current IFSM [A] non-repetitive, sine wave, Tj=25C before surge current is applied 150 100 50 0 1 2 5 10 20 50 100 Number of Cycles [cycles] |
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